Organizing Committee

Steering Committee

  • Kazunari Ishimaru

    Kioxia Corporation, Japan

    EDS VP of Meetings (Chair)

  • Ravi Todi

    Rivos Inc., USA

    EDS President

  • Fernando Guarin

    Global Foundries, USA

    EDS Senior Past President

  • Bin Zhao

    Iotelligent Semiconductor, USA

    EDS President-Elect

  • Roger Booth

    QualCom Inc., USA

    EDS Treasurer

  • Arokia Nathan

    Darwin College, Cambridge University, UK

    IFETC 2023 Co-TPC Chair

  • Xiaojun Guo

    Shanghai Jiao Tong University, China

    Co-GC (IFETC 2022 TPC Chair)

  • Samar Saha

    Prospicient Devices, USA

    IFETC 2023 General Chair

  • Muhammad M Hussain

    Purdue University, USA

    IFETC 2023 TPC Chair

  • Ta-Ya Chu

    National Research Council Canada, Canada

    EDS Flexible Electronics TC Chair

  • George Xiao

    National Research Council Canada, Canada

    C-RFID (EIC, IEEE Journal of RFID)

Executive Committee

  • Samar Saha

    Prospicient Devices, USA

    IFETC 2023 General Chair

  • Xiaojun Guo

    Shanghai Jiao Tong University, China

    Co-GC (IFETC 2022 TPC Chair)

  • Neils Benson

    University of Duisburg - Essen

    Co-GC (IFETC 2024)

  • Muhammad M Hussain

    Purdue University, USA

    IFETC 2023 TPC Chair

  • Arokia Nathan

    Darwin College, Cambridge University, UK

    IFETC 2023 Co-TPC Chair

  • Luisa Petti

    University of Bozen-Bolzano, Italy

    Co-TPC Chair (IFETC 2024)

  • Jun Yu

    Shandong University

    Publications Chair

  • S. Sundar Iyer

    Indian Institute of Technology (IIT), Kanpur

    Publications Vice-Chair

  • Susthitha Menon

    UKM, Malaysia

    Education/Short-Course Chair

  • Hiu-Yung Wong

    San Jose State University, USA

    Education/Short-Course Vice-Chair

  • Mengwei Si

    Shanghai Jiao Tong University, China

    Publicity Chair

  • MK Radhakrishnan

    NanRel, India

    Publicity Vice-Chair

  • Roger Booth

    QualCom Inc., USA

    Financial Committee Chair

  • Abhishek Raol

    Atomera, Inc., USA

    Financial Committee Vice Chair

  • Aabid Husain

    Atomera, Inc., USA

    Exhibits and Sponsorship Chair

  • Linrun Feng

    LinkZill, China

    Exhibits and Sponsorship Vice-Chair

  • Reza Arghavani

    Sandia National Laboratories

    International Advisory Committee Chair

  • Jamal Deen

    McMaster University, Canada

    International Advisory Committee Vice-Chair

International Advisory Committee

  • Reza Arghavani

    Sandia National Laboratories

    Chair

  • Jamal Deen

    McMaster University, Canada

    Vice Chair

  • Paul Berger

    Ohio State University, USA

  • Murty Polavarapu

    Space Electronics Solutions

  • Yong Lian

    Shanghai Jiao Tong University, China

  • Andrew Flewitt

    Cambridge University, UK

  • Gangqiang Yang

    Shandong University, China

  • Clarence Augustine TH Tee

    Zhejiang Normal University, China

  • Tricia Breen Carmichael

    University of Windsor, Canada

  • Sean M Garner

    Corning Research and Development Corporation, USA

  • Chen Jiang

    Tshingua University, China

  • Sungjune Jung

    Postech, Korea

  • Harish Subbaraman

    Oregon State University, USA

  • Jie Zhang

    Jiangnan University, China

  • Woo So Kim

    Simon Fraser University, Canada

  • Suman Datta

    Georgia Tech, USA

Finance Committee

  • Roger Booth

    Qualcomm, USA

    Chair

  • Abhishek Raol

    Atomera, Inc., USA

    Vice Chair

  • Samar Saha

    Prospicient Devices, USA

  • Ravi Todi

    Rivos Inc., USA

Sponsorships & Exhibition Committee

  • Aabid Husain

    Atomera, Inc., USA

    Chair

  • Linrun Feng

    LinkZill, China

    Vice-Chair

Technical Program Committee (TPC)

Subcommittee: Materials, Devices, and Processing

  • Tina Ng

    University of California, San Diego, USA

    Chair

  • Jung Ah Lim

    Korea Institute of Science and Technology, Korea

    Vice-Chair

  • Jim Tsung-Ching Huang

    Meta, USA

  • Yassser Khan

    University of Southern California, USA

  • Gerardo Hernandez Sosa

    KIT, Germany

  • Zhenghui Andy Wu

    Henan University, China

  • Kai Wang

    Sun Yatsen University, China

  • Hongki Kang

    Daegu Gyeongbuk Institute of Science and Technology, Korea

  • Sungjun Park

    Ajou University, Korea

  • Sushmee Badhulika

    Indian Institute of Technology, Hyderbad, India

  • Ratul Kr. Baruah

    Tezpur University, India

  • Jeong Park

    University of Nevada Reno, USA

Subcommittee: Energy Harvesting and Storage

  • Nazek El-Atab

    King Abdullah University of Science and Technology, Saudi Arabia

    Chair

  • Wenzhuo Wu

    Purdue University, USA

    Vice-Chair

  • Daryoosh Vashaee

    North Carolina State University, USA

  • Seok Woo Lee

    Nanyang Technological University, Singapore

  • Fan Hongjin

    Nanyang Technological University, Singapore

  • Ilias Belharouak

    Oak Ridge National Laboratory, USA

Subcommittee: Sensors, Actuators, and Bioelectronics

  • Siddhartha Panda

    Indian Institite of Technology Kanpur, India

    Chair

  • Amay Bandodkar

    North Carolina State University, USA

    Vice-Chair

  • Shweta Agrawala

    Argus University, Denmark

  • Shideh Kabiri Ameri

    Queens's University, Canada

  • Shree Prakash Tiwari

    Indian Institute of Technology Jodhpur, India

  • Pravat K. Giri

    Indian Institute of Technology Guwahati, India

  • Prashant Sonar

    Queensland University of Technology, Australia

  • John Ho

    National University of Singapore, Singapore

  • Tapio Fabritius

    University of Oulu

Subcommittee: Circuits and Systems Integration

  • Joseph Chang

    Nanyang Technological University, Singapore

    Chair

  • Karim S Karim

    University of Waterloo

    Vice Chair

  • Haniban Ma

    ACXEL/Chinese Academy of Sciences, China

  • Ling Li

    Institute of Microelectronics, China

  • Feng Yan

    Honkong Poly University

  • Eugenio Cantatore

    Eindoven University of Technology

  • Vincenzo Pecunia

    Simon Fraser University, Canada

  • Bowen Zhu

    Westlake University

Subcommittee: Functionalities, Performance, and Reliability

  • Peyman Servati

    University of British Columbia, Canada

    Chair

  • Bikram Mahajan

    Texas Instruments, USA

    Vice-Chair

  • Simon Ogier

    SmartKem Ltd, UK

  • Cunjiang Yu

    Pen State University

  • Jordi Carrabina

    Universitat Autonoma de Barcelona

  • Mitradip Bhattacharjee

    Indian Institute of Science Education and Research Bhopal, India

  • Debkalpa Goswami

    Cleveland Clinic, OH, USA

  • Lasitha Piyathilaka

    Central Queensland University, Australia

  • Xiaowei Yu

    General Motors, USA

  • Oliver Ozioko

    University of Derby, UK

Subcommittee: Packaging, Heterogeneous Integration, and Manufacturing

  • Bill Chen

    ASE Group

    Chair

  • Nancy Stoffel

    General Electric

    Vice-Chair

  • Ben Leever

    Wright Patterson Air Force Base

  • David Schwartz

    PARC

  • Deji Akinwande

    UT Austin

  • Frank Schwierz

    TU-Ilmenau, frank.schwierz@tu-ilmenau.de

  • Veena Misra

    North Carolina State

  • Jinwoo Han

    Samsung Electronics, Korea

  • Mark Poliks

    SUNY Binghamton

Subcommittee: Emerging Applications and Products

  • Sanjiv Sambandan

    Indian Institute of Science, India

    Chair

  • Chen Jiang

    Tsinghua University, Beijing, China

    Vice-Chair

  • Soumya Dutta

    Indian Institute of Technology Madras, India

  • Tapajyoti DasGupta

    Indian Institute of Science, India

  • Sheunn-jiun Tang

    Ignis Innovation

  • Jagadeshwaran Rajendran

    University Sains Malaysia

  • Yuan Yuan

    Hunan University, China

Subcommittee: Flexible and Printable Solutions in Radio-Frequency Identification

  • Luca Catarinucci

    University of Salento, Italy

    Chair

  • Will Whittow

    Loughborough University, UK

    Vice-Chair

  • Bing Zhang

    Sichuan University, China

  • Atif Shamin 

    King Abdullah University of Science and Technology, Saudi Arabia

  • Benjamin Cook

    Meta, USA

  • Riccardo Colella  

    University of Salento, Italy

  • Praveen Sekhar

    Washington State University, USA

  • Wenjing Su

    Meta, USA