Prof. Paul R. Berger, Ph.D.
General Chair, IFETC 2021
It is our great pleasure to invite you to attend the 2021 IEEE International Flexible Electronics Conference (IFETC)! The IFETC-3 will be held August 8-11, 2021 as a live virtual conference.

IFETC-3’s Technical Program covers a wide range of cutting-edge developments in printed and flexible electronics. IFETC, started in Ottawa, Canada (2018) is a new EDS-lead international conference, focusing upon printed and flexible hybrid and non-hybrid materials, devices and systems. It will rotate between the Americas, Asia and Europe, heading to Shanghai PRC in 2022. IFETC aims to bring together a wide variety of stakeholders, from chemists, materials scientists, physicists, to mechanical and electrical engineers, the fabrication and manufacturing communities, as well as end-users, e.g. packaging and medical communities.

On behalf of the Technical Program Committee, we are honored to invite you to submit an abstract on your latest achievements in flexible electronics research, development, and applications to IFETC-3. IFETC-3 aims to be a highly interactive venue for both seasoned experts as well as entry-level professionals and students. The conference provides a unique opportunity to meet, share and discuss flexible electronics developments in a timely and influential forum. Please contribute to the IFETC, as a premier international conference on the science and technology that contribute towards advancements with Internet-of-Things (IoT) objects, soft robotics, medical wearables, etc.

Besides the outstanding Technical Program, IFETC-3 will expand its educational mission by offering a strong Short Course selection, taught by leading specialists, and drawing upon the knowledge bank of the Organic and Printed Electronics Association (OE-A). These courses are offered to all of our attendees in order to learn about diverse areas in flexible electronics to enhance, update and broaden their knowledge.

The scientific and technical content of the 2021 IEEE IFETC-3 will be enhanced by Monday’s Early Evening Mixer and with local Grades 8-12 at COSI Science Center, followed by the IFETC Poster judging session with awards (1st, 2nd, 3rd). And Tuesday’s evening will start with an Open bar, (with a panoramic view across the Scioto River of the Columbus skyline and sponsored by NextFlex consortium) atop Veteran’s Memorial. The IFETC Banquet will be in Veteran’s Memorial lobby and exhibit space. Both COSI and Veteran’s are within walking distance of the conference location, or a short scooter ride away, and across the street from each other. Wednesday will begin with a Women in Engineering Breakfast, for all to attend. Additionally, there will be a Manufacturing & Workforce Panel as well as a Medical Wearable and Clinical Usage Panel combined with OSU’s Medical School. All abstracts will appear in IEEE Xplore, and selected papers will appear in a Special Issue of IEEE J-EDS.

We hope that you will enjoy the inspiring experience of being part of one of the world’s greatest conferences dedicated to the science and technology of flexible electronics. Naturally, the IEEE International Flexible Electronics Conference welcomes individuals from all backgrounds and nationalities to participate and contribute in a spirit of rational, open inquiry.

On behalf of the Organizing and International Committees, we look forward to welcoming you to the IFETC-3 this summer!