Scalable Printing of Nanoelectronics and Sensors on Rigid and Flexible Substrates
Ahmed BusnainaNortheastern University, Boston, MA & Nano OPS, Inc., Newton, MA
We introduce a new additive manufacturing technology for making nanoelectronics that is estimated to cost one to two orders of magnitude less than the current conventional semiconductor manufacturing. This is largely accomplished by reducing the initial cost of infrastructures, operating cost, power requirement, little water or chemicals use and three orders of magnitude reduction in materials used. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and allowing device designers the use of any organic or inorganic semiconducting, conductive or insulating material on flexible or rigid substrates. This will also allow industry to leverage novel properties of nanomaterials such as two-dimensional (2D) materials, quantum dots, nanotubes, etc. The new technology is enabled by directed assembly-based nanoscale printing at ambient temperature and pressure and can print 1000 faster and 1000 smaller (down to 20nm) structures than ink-jet based printing. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and sensors at ambient temperature and pressure on flexible or rigid substrates. The directed assembly-based printing processes were specifically created to be scalable, sustainable and designed to enable precise and repeatable control of assembly of various nanomaterials at high-rate. The new technology has demonstrated the printing of several devices including transistors, inverters, diodes, displays, chemical and biosensors, and interconnects using a variety of nanomaterials at the nano and microscale.
Ahmed A. Busnaina, Ph.D. is the founding Director of the National Science Foundation’s Nanoscale Science and Engineering Center for High-rate Nanomanufacturing at Northeastern University since 2004. He was a professor and a director of the Microcontamination Control Lab at Clarkson University from 1983-2000. He is internationally recognized for his work on nano and micro scale defects mitigation in semiconductor fabrication. He specializes in directed assembly-based printing of inorganic and organic conductors, semiconductors and dielectrics for nanoscale electronics and sensors. He authored more than 600 papers in journals, proceedings and conferences, 23 granted and 40 pending patents. He was awarded the 2020 American Society of Mechanical Engineers (ASME) William T. Ennor Manufacturing Technology Award and Medal. He is a fellow of National Academy of Inventors, a fellow American Society of Mechanical Engineers, the Adhesion Society, and a Fulbright Senior Scholar.
Advanced design capabilities and manufacturing considerations utilizing liquid metal conductors in flexible hybrid electronics
Mike HopkinsLiquid Wire, Inc.
Liquid metal (LM) conductors enhance flexible hybrid electronics (FHEs) in two major ways, additional flexibility and best-in-class stretchability. Durability of as built circuits under heavy flex and stretch cycling is greatly improved. Along with this enhancement come completely new modalities in design and manufacture of a circuit. The key to LMFHE manufacture is the via structure. The via becomes not only the method of generating more complex, multi-layer circuits, but also the hard to soft transition step that connects a soft circuit to the traditional world of connectors, ICs, and solid wiring. We have spent the last few years in generating robust heterogeneous junctions and via systems and characterized them under rigorous physical testing. We have also spent this time exploring creative ways in which soft circuits can be generated by laminate additive manufacture and how these can lead to novel device structures. We have determined design rules for manufacture supporting modular FHE architectures with LMFHE interconnect and via systems that lead to better mechanical and manufacturing outcomes and have metrics that show these performance increases.
Dr. Hopkins has worked in the field of soft electronics for four years with Liquid Wire Inc. Primarily operating in the role of lead electronics designer and staff scientist while the company transitioned from LLC to C-corp, and through its successful raising of multimillion dollar series A investment. Through this time Dr. Hopkins has developed many methodologies of sensing with gel phase conductors and manufacturing techniques for application of fluid and gel phase conductors. Working with many designers in the performance apparel industry he has generated many successful prototype products in the flexible hybrid electronics space. Prior to joining Liquid Wire Dr. Hopkins has worked on the design and use of many pieces of scientific equipment. Co-developing three separate near-field scanning optical microscopes with Drs. Andres LaRosa, Rodolfo Hernandez-Rodriguez, Eric Sanchez, and John Freeouf, he developed new tip designs, operation level enhancements and optimizations in signal strengthening for various detection methodologies. Dr. Hopkins has also spent many years in thin film deposition and characterization, building two thermal evaporation system and one sputter deposition system operating at high vacuum, while also using commercial deposition systems including atomic layer deposition. His work a Portland State University culminated with a Ph.D. on the topic of quantum chemistry in magnetic thin film chalcogenides.
Process-Properties-Performance Interaction of Additively Printed Flexible Circuits with Surface Mount Components
Pradeep LallNSF-CAVE3 Electronics Research Center, Department of Mechanical Engineering, Auburn, AL
A number of processes for additive printed electronics have emerged including aerosol-jet printing, inkjet printing, dispense-on-demand printing, screen-printing, gravure printing amongst others. Additive printed technologies allow for design of manufacture of electronics in exceedingly small lot-sizes owing to the ability to print parts on demand. Technologies such as aerosol-jet, ink-jet printing, and dispense-on-demand printing allow for manufacture of non-planar components without the need for planar build-up often used in traditional methods presently used for electronics design and fabrication. In this paper, the interaction of process parameters with the electrical properties, mechanical properties, and the realized performance of ink-jet printed substrates and direct-write substrates has been studied. The frequency response of additively printed circuits has been compared with conventional circuits. The shear load to failure, and resistivity of the printed line have been studied to quantify the performance of the printed lines. Process parameters studied include droplet volume, on-off voltage, phase width, on-off time, print speed, resolution, ink pressure, platen temperature, standoff height. Better understanding of the effect of each process parameter in the printed lines will allow users to select appropriate process parameters for design functional performance. In addition, the development of process-property relationships will provide visibility into the critical parameters, which require added level of attention for process-control. Process parameter drift over a long production run may be important for a high-volume production environment. The effect on the print process may be in the form of line consistency, and resistance – both of which have been quantified in this study through the quantification of process-capability for z-axis interconnects. Data is presented on 2-layer and 5-layer substrates.
Pradeep Lall is the MacFarlane Endowed Distinguished Professor with the Department of Mechanical Engineering and Director of the NSF-CAVE3 Electronics Research Center at Auburn University. He holds Joint Courtesy Appointments in the Department of Electrical and Computer Engineering and the Department of Finance. He is a member of the technical-council, academic co-lead of the asset-monitoring TWG of NextFlex Manufacturing Institute. He is the author and co-author of 2-books, 14 book chapters, and over 700 journal and conference papers in the field of electronics reliability, safety, energy efficiency, and survivability. Dr. Lall is a fellow of the ASME, fellow of the IEEE, a Fellow of NextFlex Manufacturing Institute, and a Fellow of the Alabama Academy of Science. He is recipient of the Auburn Research and Economic Development Advisory Board Award for Advancement of Research and Scholarship Achievement, IEEE Sustained Outstanding Technical Contributions Award, National Science Foundation’s Alex Schwarzkopf Prize for Technology Innovation, Alabama Academy of Science’s Wright A. Gardner Award, IEEE Exceptional Technical Achievement Award, ASME-EPPD Applied Mechanics Award, SMTA’s Member of Technical Distinction Award, Auburn University’s Creative Research and Scholarship Award, SEC Faculty Achievement Award, Samuel Ginn College of Engineering Senior Faculty Research Award, Three-Motorola Outstanding Innovation Awards, Five-Motorola Engineering Awards, and over Thirty Best-Paper Awards at national and international conferences.
Ultrahigh resolution printing and novel materials for piezoelectric sensing, photonic metasurfaces and quantum materials
J. Devin MacKenzieUniversity of Washington
In this talk we will discuss breaking through resolution and performance barriers in printed sensors, photonics and quantum materials with femtoliter inkjet printing and novel functional inks. The high resolution and emerging materials define a pathway to printed electronics delivering not only low cost, large area scalability and flexibility in form and design, but also printed devices that can exceed the performance of conventional electronics. This is being enabled by a combination of electric-field driven micron-scale droplet generation and new solution-processed perovskite piezoelectric and nanocrystal layer inks and engineered high index dielectric inks.
J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW. Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration. Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom. Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories. Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times.
New Materials for Flexible and Stretchable Electronics
Joey L. MeadUniversity of Massachusetts Lowell
As the number of applications for printed flexible and stretchable electronics increases, new materials and material combinations will be required to meet application requirements. This talk will cover recent developments in materials for flexible and stretchable electronics including substrates, conductors, and encapsulants. New substrates include the creation of a tunable substrate by combining barium strontium titanate (BST) with both a thermoplastic and a thermoset elastomer. By varying the filler loading, the dielectric properties of the material can be adjusted. The use of BST also generates a tunable substrate. Use of an elastomer provides higher loadings of up to 40 vol % BST with high stretch good recovery (low permanent set). The substrates can be printed with a commercially available stretchable ink, providing a material with stretch in excess of 100%, but is dependent on the cure system of the elastomer. Work on new stretchable conductors includes the use of carbon nanotube yarns in unique structures that give resistivity that is independent on the degree of stretch. The materials could be used as wires to connect sensors and other devices in stretchable applications such as soft robotics. New encapsulants include superhydrophobic systems that can be easily coated onto flexible and stretchable substrates. Compatibility considerations include solvents, wetting characteristics, and temperature resistance of each component. Further developments in printable substrates include the patterning of the surfaces into regions of different wettability at the micro and nanoscale to give tailored wetting and compatibility with inks.
Joey Mead received her S.B. in chemistry from MIT (1981) and her Ph.D. in Polymers from the Department of Materials Science and Engineering from MIT (1986). She worked for over 10 years as a Materials Engineer for the Army Research Laboratory in Watertown, MA. She is a Distinguished University Professor, David and Frances Pernick Nanotechnology Professor in the Department of Plastics Engineering at the University of Massachusetts Lowell. She is also the Director of the NSF I/UCRC SHAP3D and Director of the Center for Advanced Manufacturing of Polymers and Soft Materials (AMPS) at UMass Lowell. She was previously the Deputy Director of the NSF Center for High-rate Nanomanufacturing. She received the George Stafford Whitby Award for Distinguished Teaching & Research in 2018 from the Rubber Division of the American Chemical Society and became a NextFlex Fellow in 2021. Her research interests include nanomanufacturing and nanoscale patterning of polymeric materials, stretchable electronic materials, structure-properties of polymers, elastomers, and thermoplastic elastomers. She has over 200 publications and 10 book chapters.
Multimaterial Additive Manufacturing of Radiofrequency Devices and Systems
Mark MirotznikUniversity of Delaware
While the current AM market has been growing rapidly, it is still built primarily around single material based systems. However, over the last few years we have seen an increase in commercially available multi-material AM systems that are much more material agnostic allowing users to print a wide range of commercial or custom made materials using various integrated print modalities. This opens up the possibility of fabricating complete radiofrequency systems using a single machine. In this presentation I will discuss recent progress on the use of multi-material additive manufacturing (AM) towards the development of novel radiofrequency devices and systems including conformal integration of printed connectors, baluns, antennas, transmission lines and passive beam steering lenses.
Mark Mirotznik is a professor and associate chair of the Electrical Engineering Department at the University of Delaware. He is also the Associate Director of Additive Manufacturing for UD’s Center for Composite Materials (CCM). He received the B.S.E.E. degree from Bradley University, Peoria, IL, in 1988 and the M.S.E.E. and Ph.D. degrees from the University of Pennsylvania, Philadelphia, in 1991and 1992, respectively. From 1992 to 2009, he was a faculty member in the Department of Electrical Engineering at The Catholic University of America, Washington, DC. In addition to his academic positions, he is an associate editor of the Journal of Optical Engineering and is a Senior Research Engineer for the Naval Surface Warfare Center (NSWC), Carderock Division. Prof. Mark Mirotznik’s research is focused on the development of novel advanced manufacturing methods and materials for use in high frequency electronics, radiofrequency devices and sensors.
Uniaxial and Multiaxial Test Techniques for Reliability Assessment of Flexible and Wearable Electronics
Suresh K. SitaramanThe George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Dramatic advances in materials synthesis and processing, scalable manufacturing, and on-demand and customizable design have led to increasing interest in flexible and wearable electronics for a wide range of application areas such as health care, energy, transportation and mobility, communications, defense and security, safety, water, and food. To sustain and grow the enormous interest in flexible and wearable electronics, it is critical to ensure that flexible and wearable devices and systems are reliable through their intended operational life. In this presentation, I will discuss some of the uniaxial and biaxial reliability test techniques that are under development in our lab, and how these techniques can be employed to mimic in-use conditions of flexible and wearable electronics devices and systems. I will present physics-based computational simulations to provide insight into the stress-strain evolution at various locations, and to demonstrate how damage evolution can be linked to failures. Details from cross-sectional images as well as digital image correlation measurements will also be discussed. I will close the discussion by examining various practical applications and their potential failure modes, and how the developed test techniques can be tailored toward examining such applications.
Dr. Suresh K. Sitaraman is a Regents’ Professor and a Morris M. Bryan, Jr. endowed Professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology (Georgia Tech). Dr. Sitaraman is the Lead Faculty for NextFlex at Georgia Tech, and also directs the Computer-Aided Simulation of Packaging Reliability (CASPaR) Lab. His expertise is in the areas of micro- and nano-scale structure fabrication, testing and characterization and physics-based modeling and reliable design, as applied to flexible and rigid microsystems. Prior to joining Georgia Tech in 1995, Dr. Sitaraman was with IBM Corp. Dr. Sitaraman has co-authored more than 320 journal and conference publications over the past few years. He has managed several research and development projects funded by US federal agencies, industry, and other sources totaling millions of dollars, and has mentored a vast array of post-doctoral fellows as well as doctoral, master’s, bachelor’s, and high-school students. Dr. Sitaraman’s work has been recognized through several awards and honors. Among them, he has received the Zeigler Outstanding Educator Award from Georgia Tech/Mechanical Engineering in 2019, the NextFlex Fellow recognition in 2018, the Outstanding Achievement in Research Program Development Award (Team Leader) from Georgia Tech in 2017, the ASME/EPPD (Electronic and Photonic Packaging Division) Applied Mechanics Award in 2012 and the Thomas French Achievement Award from the Department of Mechanical and Aerospace Engineering, The Ohio State University in 2012. Dr. Sitaraman has received the Sustained Research Award from Georgia Tech – Sigma Xi in 2008 and the Outstanding Faculty Leadership Award for the Development of Graduate Research Assistants, Georgia Tech in 2006. His co-authored papers have won the Commendable Paper Award from IEEE Transactions on Advanced Packaging in 2004 and the Best Paper Award from IEEE Transactions on Components and Packaging Technologies in 2001 and 2000. Dr. Sitaraman has also received the Metro-Atlanta Engineer of the Year in Education Award in 1999 and the NSF-CAREER Award in 1997. Dr. Sitaraman serves as an Associate Editor for IEEE Transactions on Components, Packaging, and Manufacturing Technology. Dr. Sitaraman is an ASME Fellow.
Flexible Multilayer Printed Circuit Board Prototype Offering for Confined Form Factors
John WilliamsAdditive Electronics Manufacturing (AET), Boeing Research and Technology
Boeing is rapidly prototyping multilayer flexible printed circuit boards (Flex-PCBs) for size weight power and cost saving applications. Flex PCBs allow electronics to be wrapped onto cylindrical or bi-axial curved surfaces. Conventional Flex PCBs contain either one to four copper layers with limited electronic packaging. Most devices are bonded on either end to rigid boards that contain complex packaged electronics. However, our process extends this effort to complete the entire electronics application from single to eight layer boards. Thus allowing antennas, sensors, communication links, and radars to be placed directly onto the surface of a vehicle. Similarly, power routing, and microcontrollers can conform to the surface or interior cavity. This technology provides a transformative approach to packaging PCBs in aerospace applications. Our team has demonstrated this capability on RF boards with no less than 500 through vias, 100 buried vias, and 50 electronically packaged components. Boards can be turned in days without electroplating. Pyralux AP polyimide substrates from DuPont, Taconic, and 3M bonding adhesive achieves alignment errors of 2 mil or less over an 8 x 10 square inch area. Kapton substrates can also be used with additional alignment risk. Patterning can be completed with either copper or silver ink. Vias are filled using conductive inks. Electronic packaging is currently performed using anisotropic conductive epoxy, but industrially standard solder attach is also available for copper clad and plated devices. Cost models have been completed for printed silver devices, documenting the manufacturability from MRL 4 to 6. We are currently examining pilot capability of different suppliers to manufacture devices as needed.
Dr. Williams is an Associate Technical Fellow and the lead engineer for Additive Electronics Manufacturing at Boeing Research and Technology (BR&T) in Huntsville. After completing his PhD, John served as the science and technology lead for the Metal Micromachining effort at Sandia National Laboratories in Albuquerque, NM. He later joined the University of Alabama in Huntsville as an Assistant Professor of Electrical, Materials, and Optical Engineering and Associate Director of the their Nano and Micro Devices Center. Dr. Williams has more than 15 years of experience as a PI lead for prototype development of microelectromechanical systems (MEMS) with over 27 patents and 40 peer reviewed publications in the areas of materials processing, metals, microfabrication, photonics, and RF electronics and bioMEMS. Dr Williams’ research has been funded by NSF, DARPA, NASA, NIH, and US ARMY-SMDC. He is currently the Principal Investigator on five NextFlex projects used to improve manufacturing readiness of materials and processes to multilayer layer printing of DC electronics, antennas, and complex multilyaer printed circuit boards for RF applications.
Chemistry & Materials
Towards Efficient and Stable Printed Single-Layer OLEDs
Paul W.M. BlomMax Planck Institute for Polymer Research, Ackermannweg 10, 55128 Mainz, Germany
The efficiency and stability of single-layer polymer light-emitting diodes is compromised by unbalanced charge transport, absence of triplet-exciton harvesting and low photoluminescence quantum efficiencies. We demonstrate that tuning the energy levels of the organic semiconductor can prevent charge trapping, which is the main cause of unbalanced charge transport, resulting in a symmetric broadened emission zone. A broadened recombination zone is beneficial for the lifetime of organic light-emitting diodes (OLEDs), but its effect on the optical outcoupling efficiency is unknown. By combining an electrical and optical model we demonstrate that the total outcoupling can be calculated as the integral of the outcoupling efficiency over different positions of emitting dipoles, weighted by the sum-normalized recombination profile, as obtained from electrical modeling. For a single-layer OLED based on the thermally delayed activated fluorescence emitter 9,10-bis(4-(9H-carbazol-9-yl)-2,6-dimethylphenyl)-9,10-diboraanthracene (CzDBA) the outcoupling efficiency to air mode can be as high as ~24%. As a result, single-layer devices with a broadened emission zone can achieve similar outcoupling efficiency to multilayer OLEDs establishing a route to efficient, stable, and simplified OLEDs.
Paul W.M. Blom received his Ph. D. Degree in 1992 from the Technical University Eindhoven on picosecond charge carrier dynamics in GaAs. At Philips Research Laboratories he was engaged in the electro-optical properties of polymer light-emitting diodes. From 2000 he held a professorship at the University of Groningen in the field of electrical and optical properties of organic semiconducting devices. In September 2008 he became Scientific Director of the Holst Centre in Eindhoven, where the focus is on foil-based electronics, followed in 2012 by an appointment as director at the MPI for polymer research in the field of molecular electronics.
Pushing the Limits of Printed and Flexible Organic Electronics: Thin, Fast and … Edible.
Mario CaironiCenter for Nano Science and Technology @PoliMi, Istituto Italiano di Tecnologia, Via Pascoli 70/3, Milano, Italy
Printed polymer field-effect transistors (FETs) have been considered for many novel applications towards large area and flexible electronics, since they can enable pervasive integration of electronic functionalities in all sorts of appliances, their portability and wearability. Here I will report on our recent efforts in making printed polymer electronics (i) ultrathin, to enhance as much as possible conformability, (ii) fast switching, to enable more applications at Radio-Frequencies and (iii) edible, towards electronics systems made with non-toxic, ingestible materials, serving smart pharmaceuticals and food-tagging applications.
Mario Caironi obtained his Ph.D. in Information Technology with honours at Politecnico di Milano (Milan, Italy). In 2007 he joined the group of Prof. Sirringhaus at the Cavendish Lab. (Cambridge, UK) as a post-doc, working for 3 years on high resolution printing of downscaled organic transistors and circuits, and on charge transport in high mobility polymers. In 2010 he was appointed as Team Leader at the Center for Nano Science and Technology@PoliMi (CNST) of the Istituto Italiano di Tecnologia (IIT, Milan, Italy). In 2014 he entered the tenure track at the same institution, obtaining tenure in 2019. He is currently interested in solution based high resolution printing techniques for micro-electronic, opto-electronic and thermoelectrics devices, in the device physics of organic semiconductors based field-effect transistors, in biomedical and/or implantable sensors and electronics for the healthcare. He is a 2014 ERC Starting grantee and a 2019 ERC Consolidator grantee.
Organic Bioelectronics: Next Generation Point-of-Care Sensors
Anna-Maria PappaUniversity of Cambridge
The development of micro-electronic devices/chips that bridge the gap between the rigidity of traditional electronics with the soft mechanics of biological systems is highly desirable. The emergence of highly conjugated polymers has indeed opened up exciting directions in biomedical research including point-of-care diagnostics. With the ultimate goal of fully integrated wearable sensors combined with IoT, and that of autonomous at-home diagnostic tests, organic bioelectronic technologies have been heavily explored the past decade resulting in novel device configurations. Multiplexing capability, ability to adopt to complex performance requirements in biological fluids, sensitivity, stability, literal flexibility and compatibility with large-area processes are only some of the merits of conjugated polymers for point of care diagnostics. This talk will summarize our recent efforts on developing biosensors for health monitoring, on rigid and flexible substrates showcasing the potential of conjugated polymers towards next generation point of care sensors.
Anna-Maria Pappa is an Oppenheimer Research Fellow in the Department of Chemical Engineering and Biotechnology at the University of Cambridge. She is also a research Fellow in Pembroke College in Cambridge. She holds a PhD in Bioelectronics from Ecole Mines de Saint-Étienne, France, where she held a Marie Curie fellowship. She has been awarded the L’Oreal UNESCO Science fellowship (2017) and has been included in the Under 35 Young Innovators list by the MIT Technology Review for 2019. Her research combines microelectronics with biological models for next generation in vitro assays.
Semiconducting: Insulating Polymer Blends Targeted for Flexible Optoelectronic Applications
Natalie StingelinSchool of Materials Science & Engineering / School of Chemical & Biomolecular Engineering, Georgia Institute of Technology
In recent years, immense efforts in the flexible electronics field have led to unprecedented progress and to devices of ever increasing performance. Despite these advances, new opportunities are sought in order to widen the applications of organic-based technologies and expand their functionalities and features. For this purpose, use of multicomponent systems seems an interesting approach in view of, e.g., increasing the mechanical flexibility and stability of organic electronic products as well as introducing other features such as self-encapsulation. One specific strategy is based on blending polymeric insulators with organic semiconductors; which has led to a desired improvement of the mechanical properties of organic devices, producing in certain scenarios robust and stable architectures. Here we discuss the working principle of semiconductor:insulator blends, examining the different approaches that have recently been reported in literature. We illustrate how organic field-effect transistors (OFET)s and organic solar cells (OPV)s can be fabricated with such systems without detrimental effects on the resulting device characteristics even at high contents of the insulator. Furthermore, we review the various properties that can be enhanced and/or manipulated by blending including air stability, mechanical toughness, H- vs. J-aggregation, etc.
Reinventing Electronics for a Flexible World
Feras AlkhalilPrincipal Scientist and Director of R&D, PragmatIC
The key global challenges we currently face include health and wellbeing, sustainable and secure food supplies, the need for greener cities and climate change . Tackling these challenges requires innovative approaches that can be deployed in a decentralised and democratised way. PragmatIC is a world leader in the design, development and manufacture of ultra-low-cost Flexible Integrated Circuits (FlexICs). Designers can leverage PragmatIC’s innovative technology with its novel form-factor using our FlexIC Foundry™ offering to create ubiquitous low-cost smart systems. Envisaged implementations include enabling platforms that can monitor the environment around them and determine outcomes at a fraction of the cost and environmental impact of traditional silicon solutions. In this talk, we will present novel technologies that we are currently developing for future inclusion in our FlexIC Foundry platform, including Schottky rectification, low power complementary metal oxide technology and non-volatile memory. These technology capabilities will ultimately enable designers to create even more innovative designs with PragmatIC’s FlexIC Foundry.
Dr. Feras Alkhalil joined PragmatIC in September 2015 and leads the research and development activities at PragmatIC. He received his MSc and Ph.D. from the University of Southampton in Microelectronics System Design and Solid-State Electronics, respectively. Feras is a visiting fellow at Durham University, Department of Physics since September 2017, he holds 5 patents and has published in over 15 international journals.
Organic Transistor Materials for Organic Liquid Crystal Displays
Active matrix backplanes on glass almost exclusively use hard ceramic based materials as the basis for the fundamental transistor technology. To enable flexible displays and electronics, FlexEnable has pioneered an alternative manufacturing approach with soft, flexible organic materials as the active layers. In this talk we will review the best in class organic transistor materials and their fundamental electrical performance. We will also discuss how these materials enable plastic liquid displays with unique form factors.
Mike Banach is the Technical Director at FlexEnable. He started his career as a researcher in flexible electronics at the Air Force Research Laboratories at Wright Patterson Air Force Base in USA. He joined FlexEnable in 2003 and has played an instrumental role in developing and industrialising its proprietary flexible electronic technology. As technical director, Mike has lead the team behind breakthrough technology developments with organic transistors including OLED and LCD displays and digital circuit applications. He holds a doctorate degree from the University of Cambridge and a BA from the University of Cincinnati.
Solution Processed Organic Photodetectors: Science, Technology and Applications.
A.J.J.M. (Albert) van BreemenHolst Centre/TNO, Eindhoven, The Netherlands
Thanks to their low-temperature processing on large-area flexible substrates thin-film organic photodetectors (OPDs) are very attractive for a range of large area imaging and sensing applications. The presentation will consist of two parts. In the first part I will focus on better understanding the physical mechanisms that determine the intrinsic limits of the detectivity of OPDs, in particular the dark current in relation to dark injection and charge generation-recombination currents. In the second part will present some recent developments in realizing curved X-ray detectors and -upon integration with OLED displays - biometric scanners that can accurately image finger-, palm and vein patterns and simultaneously record PPG signals that can be used to monitor health parameters such as heart beat, oxygen saturation and blood pressure, thus demonstrating the advantages of organic photodiodes in high-resolution, flexible large-area photodetectors.
Albert van Breemen started his career as an organic and polymer chemist, focusing on the synthesis and characterization of novel semiconductors for organic light emitting diodes. The expertise gained during this PhD research has been broadened toward large area processing of electrical functional molecules and polymers and its use in a variety of advanced flexible electronics prototypes. His current research interests include novel solution-processed semiconductors and their use in large area image sensors for medical applications.
From Flexible Perovskite Solar Cells to Large Area Modules: Challenges and Perspectives
Francesca BrunettiElectronic Eng. Dept. - University of Rome Tor Vergata Via del Politecnico
Flexible perovskite solar cells (FPSCs) are prime candidates for several applications like consumer electronics, avionic and spacecraft where bendability, conformability and high power-to-weight ratio are required. Despite record efficiencies of lab-scale flexible devices (19.5% on 0.1 cm2 area), FPSCs are still lagging behind their rigid counterparts, which in very short time have rocketed 25.2% efficiency. Several questions related to these devices are still open and represent critical factors towards the commercialization of this technology: which are the demanding aspects to face when moving from rigid to flexible substrates? What are the strategies necessary to scale up from flexible perovskite solar cells to modules (FPSMs) using large-area automated techniques? How can the stability issue be addressed for flexible devices? This talk will explore possible answers to those questions showing also an example of a potential application of FPSMs in the field of flexible portable electronics.
Prof. Francesca Brunetti received her PhD in Telecommunications and Microelectronics from the University of Rome Tor Vergata in 2005. In 2005, she was awarded of a Marie Curie Individual Fellowship spent in the Institute for Nanoelectronics of the Technical University of Munich, Germany. In 2006 she became researcher in the Department of Electronic Engineering of the University of Rome Tor Vergata, and since 2018, she is associated professor at the same Department. Cofounder of the Centre for Hybrid and Organic Solar Energy at the University of Rome Tor Vergata (CHOSE, www.chose.it) her current research is focused on the analysis, design and manufacture of electronic and optoelectronic devices. In particular, her attention is focused on organic photodetectors for applications in low cost optical communications, third-generation organic solar cells on flexible substrates, graphene for application in organic solar cells, perovskite solar cells and large are modules. Recently, she started an activity on the realization of supercapacitors on flexible and recyclable substrates, among which paper. Prof. Brunetti has published more than 60 articles in the most prestigious international journals, she holds 5 patents. She is associated editor of the journal "Sustainable Energy and Fuels" (RSC).
Development of Printed Electrolyte-Gated Transistors for Biological Sensing Applications
Ta-Ya ChuAdvanced Electronics and Photonics Research Centre, National Research Council Canada, Ottawa, Ontario, Canada
In this talk, the challenges and opportunity of electrolyte-gated field effect transistors (EGFET) will be introduced for the biological sensing applications. Different type electrolyte materials have been applied for EGFET in the last two decades, the state-of-the-art in the application of biosensing will be presented. Proton conducting polymer electrolytes have shown a great potential due to their high ionic conductivity and environmental stability. We have demonstrated a phosphoric acid-PVA proton conducting polymer EGFET with organic semiconductor which achieved a low subthreshould swing of 90 mV/decade with sub 1 V operation voltage and a high ON/OFF ratio of 105. Further development of printing process for the fabrication of printed sweat wristband will be discussed.
Dr. Chu has been working as a Research Officer/Scientist at National Research Council Canada since 2008. He has more than twenty years of experience in the field of organic electronics, such as OLED, OPV, OTFT and printable electronics. He has contributed more than fifty publications in peer-reviewed journals and conference proceedings which have been cited more than 3,000 times. Dr. Chu is also an Adjunct Professor in the Department of Materials Science and Engineering at University of Toronto. He also serves as the chair of the IEEE EDS Flexible Electronics and Display Technical Committee and the Canadian Vice-Chair for IEC TC-119 Printed Electronics.
Flexible, Stretchable and Healable Bioelectronics
Fabio CicoiraDepartment of Chemical Engineering, Polytechnique Montréal, Canada
Organic electronics, based on semiconducting and conducting polymers, have been extensively investigated in the past decades and have found commercial applications in lighting panels, smartphone and TV screens using OLEDs (organic light emitting diodes). Many other applications are foreseen to reach the commercial maturity in future in areas such as transistors, sensors and photovoltaics. Organic electronic materials, apart from consumer electronics, are playing a central role in a myriad of novel applications that are becoming ubiquitous in our society, such as artificial muscles, electronic skin, prosthetics, smart textiles, rollable/foldable displays and biomimetics. Progress in these fields comes after decades of intense research and development in materials science and engineering, which have resulted in materials combining properties that are often mutually exclusive. For instance, materials showing high flexibility/stretchability, self-healing electronic/ionic conductivity, enhanced optoelectronic performance are now a reality.
Another flourishing field is that of organic bioelectronics, where devices such as conducting polymer electrodes are used for recording and stimulating neural, muscular and nerve activity. In such applications, organic polymers are very attractive candidates due to their distinct properties of ionic/electronic conduction, which leads to a lower impedance at the electrode/tissue interface, oxide-free interfaces, tunable mechanical properties, which allow films to be deposited on irregular surfaces and tunable surface chemistry, which permits to promote or hinder the adhesion of biomolecules. These features can be particularly useful for enhancing the performance and the biocompatibility of implantable electrodes and other biomedical or wearable devices. My talk will deal with processing and characterization of conducting polymer films and devices for flexible, stretchable and healable electronics as well as for implantable electrodes. I will particularly focus on processing of conducting polymer films and hydrogels for flexible and stretchable devices, on processing strategies to fabricate stretchable and self-healing conductors, on the fabrication and characterization, in vitro and in vivo, of electrodes for deep brain stimulation and electromyography.
Fabio Cicoira is an full professor of Chemical Engineering at Polytechnique Montreal. He holds a MSc in Chemistry from the University of Bologna and a PhD in Materials Science and Engineering from the Swiss Federal Institute of Technology Lausanne. Before joining Polytechnique Montreal, he worked at the National Research Council of Italy, at the Institut Nationale de la Recherche Scientifique (Varennes, QC), and at Cornell University. He is recognized for his studies of organic field-effect transistors, electrochemical transistors, flexible, stretchable and healable electronics. He has published over 80 articles in international peer-reviewed scientific journals and several book chapters. His works have been cited more than 3000 times and his ISI H-index is 34 (38 in Google Scholar). He has been invited over 40 times to talk at international conferences and he has given over 30 seminars in universities and national laboratories worldwide. From 2007 to 2010 he has been recipient of the prestigious Marie Curie International Outgoing Fellowship from the European Union. He is editorial board member of the journal Scientific Report (Nature Publishing Group). He is a member of the Transmedtech Institute, the Stitch Institute (UBC), the Regroupement Québecois sur les Matériaux de pointe, the Research Center for High performance polymers and composites. He has been a visiting professor at the ETH Zurich in 2019. He is a fellow of the Royal Society of Chemistry.
Liquid Metal Enabled Soft and Stretchable Electronics
Michael DickeyNC State University, Camille and Henry Dreyfus Professor, Department of Chemical and Biomolecular Engineering
Liquid Metals? Usually the term evokes thoughts of mercury (toxic!) or the Terminator (a villain!). Yet, gallium-based liquid metals are often overlooked despite their remarkable properties: melting points below room temperature, water-like viscosity, low-toxicity (unlike Hg), and effectively zero vapor pressure (they don’t evaporate!). They also have, by far, the largest interfacial tension of any liquid at room temperature. Normally small volumes of liquids form spherical or hemi-spherical structures to minimize surface energy. Yet, these liquid metals can be patterned into non-spherical shapes (cones, wires, etc) due to a thin, oxide skin that forms rapidly on its surface. This talk will describe efforts in our research group to harness this oxide to pattern and manipulate metal into shapes—such as wires and particles—that are useful for applications that call for soft and deformable metallic features. It is possible to pattern the metal by injection into microchannels or by direct-write 3D printing at room temperature to form ultra-stretchable wires, deformable antennas, and microelectrodes. It is also possible to remove / deposit the oxide using electrochemistry to manipulate the surface tension of the metal over unprecedented ranges (from the largest tension of any known liquid to near zero) and thereby control the shape and position of the metal for shape reconfigurable devices. This work has implications for soft and stretchable electronics; that is, devices with desirable mechanical properties for human-machine interfacing, soft robotics, and wearable electronics.
Michael Dickey received a BS in Chemical Engineering from Georgia Institute of Technology (1999) and a PhD from the University of Texas (2006) under the guidance of Professor Grant Willson. From 2006-2008 he was a post-doctoral fellow in the lab of Professor George Whitesides at Harvard University. He is currently the Camille and Henry Dreyfus Professor in the Department of Chemical & Biomolecular Engineering at NC State University. He completed a sabbatical at Microsoft in 2016. Michael’s research interests include soft matter (liquid metals, gels, polymers) for soft and stretchable devices (electronics, energy harvesters, textiles, and soft robotics).
A Critical Comparison of Printed Semiconductor Based Thin-Film Transistor Technologies for Small Channel Length Applications
Ananth DodabalapurThe University of Texas at Austin
Thin-film transistor (TFTs) channel lengths need to shrink as performance requirements get more demanding for several applications. The switching speed and current drive capability are expected to improve as channel lengths reduce for most field-effect transistors. In many TFTs, contact resistance issues get severe at small channel length. Additionally, the physics of charge transport and basic performance characteristics can change quite substantially at small channel lengths in the range 10 nm – 3 micrometer. We will review these properties for amorphous metal oxide, polymer/organic, and printed single walled carbon nanotube TFTs. Such semiconductors can be deposited from solution by printing.
Ananth Dodabalapur received his Ph.D. degree in Electrical Engineering from The University of Texas at Austin in 1990. Between 1990 and 2001 he was with Bell Laboratories, Murray Hill, NJ. He has published more than 250 articles in refereed journals which have resulted in an H Index of more than 90 (Google Scholar), and has 27 issued US patents, which have been cited nearly 2000 times. Since September 2001, he is with The University of Texas at Austin and holds the Motorola Regents Chair in Engineering. His present research includes organic and inorganic thin-film transistors and optoelectronic devices, 2D materials device physics and device chemistry, and flexible thin-film electronics. In 2003, he co-founded OrganicID, a company that is investigating using printable polymer electronics to fabricate low-cost RFID tags for the 13.56 MHz frequency. He was the founding Editor-in-Chief of Flexible and Printed Electronics.
Highly Compliant Flexible and Printable Magnetoelectronics for Human-Machine Interfaces and Soft Robotics
Denys MakarovHelmholtz-Zentrum Dresden-Rossendorf
Motion sensing is the primary task in numerous disciplines including industrial robotics, prosthetics, virtual and augmented reality appliances. In rigid electronics, rotations, displacements and vibrations are typically monitored using magnetic field sensors. Here, we will discuss the fabrication of flexible, stretchable and printable magnetoelectronic devices. The technology platform relies on high-performance magnetoresistive and Hall effect sensors deposited or printed on ultrathin polymeric foils. These skin compliant flexible and printable magnetosensitive elements enable touchless interactivity with our surroundings based on the interaction with magnetic fields, which is relevant for smart skins, soft robotics and human-machine interfaces.
Denys Makarov obtained his Master Degree (2005) at the Taras Shevchenko National University of Kyiv in Ukraine, followed by a Ph.D. (2008) from the University of Konstanz in Germany. Until September 2015, he was group leader of “Magnetic Nanomembranes” at the Leibniz IFW Dresden. Since October 2015, Denys Makarov is a member of the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) and currently assumes a position of the head of department “Intelligent materials and systems” and leads the Helmholtz Innovation Lab FlexiSens. With his activities, Denys Makarov made a decisive contribution to the development of the field of curvilinear magnetism and stimulated research on spintronics on flexible, bendable and stretchable surfaces. Mechanically flexible, printable and skin compliant magnetic field sensors enable new application scenarios for human-machine interfaces, soft robotics, eMobility and medicine. The development of this novel research field is supported in the frame of major national and European projects. Denys Makarov a Senior Member of the IEEE and a Fellow of the Young Academy of Europe.
Recent Advances in Flexible Electrophoretic Display Technology Including Full Color Reflective Displays
Michael D. McCrearyE Ink Corporation
Electrophoretic display technology (EPD) is intrinsically flexible. New advancements have been recently achieved in foldable full color EPD including front lights as well as rollable B&W EPD. The importance of EPD to education and health markets will be discussed including the stress put on hospital communication systems by COVID
Dr. Michael McCreary is responsible for expanding the portfolio of advanced technologies at E Ink to help enabling new generations of novel electronic paper and other products. Dr. McCreary is a veteran of the imaging industry with a 47 year career that spans chemical photographic image capture, digital chip image capture, and digital display imaging. He also currently serves on the Governing Board of the SEMI FlexTech Alliance Council. Prior to joining E Ink in 2000, McCreary held a number of leadership positions with the Eastman Kodak Company, the last one being General Manager of the Microelectronics Technology Division which developed world record high performance solid-state image sensors including the CCDs used in high quality Nikon and Canon professional cameras. McCreary earned his Ph.D. in Physical Organic Chemistry from the Massachusetts Institute of Technology and completed further studies in solid state and device physics at the Rochester Institute of Technology. Dr. McCreary has been a frequent invited speaker at many international technical symposia and is named co-inventor on 92 patents worldwide.
Flexible Piezoelectric Ultrasonic Transducers Based on Thin-Film Technology: from technology to driving methodologies
Kris MynyKU Leuven, Heverlee, Belgium, imec, Heverlee, Belgium
Mid-air ultrasound applications such as vibrotactile feedback and gesture recognition have recently gained traction in the domain of human-machine interaction (HMI) . The ability to integrate flexible ultrasound transducers arrays to various surfaces presents an opportunity to enable non-contact HMI applications, which is becoming increasingly relevant given the recent COVID-19 pandemic. I.e. mitigating pathogenic cross-infection from touching surfaces. Interactive applications which can be enhanced using haptic feedback and/or gesture control such as virtual or augmented reality and telepresence are also foreseen. In order to enable those applications, we will discuss the piezoelectric ultrasound micromachined transducers (pMUTs) that we have developed using thin-film technology processes. These polymer-based pMUTs have the capability to be directly fabricated on flexible thin-film substrates, with the ability to be monolithically integrated with thin-film transistors (TFTs) as those used in the display industry. In the next section, we will discuss the modeling and driving of air-coupled pMUTs from electrical to acoustical simulations . Driving these pMUT arrays to attain a high acoustic pressure field poses significant challenges in terms of power consumption and efficiency. Advanced charge recycling is introduced to tackle these challenges and reduce the required power consumption to drive pMUT arrays . In addition, the monolithic integration of these pMUT arrays with TFT drivers introduces new challenges compared to a silicon-based solution. In this talk we elaborate upon the complexities to design driving circuits for pMUT arrays.
Finally, we will discuss the direction and future developments of the thin-film ultrasound transducer technology, which includes the investigation of alternative piezoelectric materials, pMUT array topologies and driving architectures to improve efficiency and performance.This work is supported by the FWO grant of HAPPY: haptic feedback the next step in smart interfacing - S004418N.
Kris Myny received his PhD degree in electrical engineering from the KU Leuven, Leuven, Belgium, in 2013. He is now a Principal Member of Technical Staff and R&D Team Leader at imec, and part-time professor at KU Leuven. He specializes in circuit design for flexible thin-film transistor applications. His work has been published in numerous international journals and conferences, including Nature Electronics and several ISSCC contributions. He was listed as one of Belgium’s top tech pioneers by the business newspaper De Tijd and received in 2018 the European Young Researcher Award for design on thin-film electronics. In 2016 he also received a prestigious ERC Starting Grant from the European Commission to enable breakthrough research in thin-film transistor circuits (FLICs). He is now a member of the Young Academy of Belgium between 2019-2024. He also serves as track chair of the FLEPs conference.
Hybrid Systems-in-Foil – Enabler of High-performance Flexible Electronics
Joachim N. Burghartz and Zili YuInstitut für Mikroelektronik Stuttgart (IMS CHIPS), Stuttgart, Germany
Flexible electronics add mechanical flexibility, adaptivity and stretchability as well as large-area placeability to electronic systems, thus allowing for conquering fundamentally new markets in consumer and commercial applications. Hybrid assembly of large-area devices and ultra-thin silicon chips on flexible substrates is now viewed as an enabler to high-performance and reliable industrial solutions as well as high-end consumer applications of flexible electronics. This talk discusses issues in ultra-thin chip fabrication, device modeling and circuit design under bending stress, on- versus off-chip sensor implementation, as well as assembly and interconnects for thin chips and distributed large-area components in Hybrid Systems-in-Foil (HySiF). Several distinct application examples are given to illustrate the advantages of the HySiF approach.
Joachim N. Burghartz is an IEEE Fellow, an IEEE Distinguished Lecturer, recipient of the 2014 EDS J.J. Ebers Award, and an ExCom member of the IEEE Electron Devices Society. He received his MS degree from RWTH Aachen in 1982 and his PhD degree in 1987 from the University of Stuttgart, both in Germany. From 1987 thru 1998 he was with the IBM T. J. Watson Research Center in Yorktown Heights, New York, where he was engaged in early development of SiGe HBT technology and later in research on integrated passive components, particularly inductors, for application to monolithic RF circuits. From 1998 until 2005 he was with TU Delft in the Netherlands as a full professor and from 2001 as the Scientific Director of the Delft research institute DIMES. In fall 2005 he moved to Stuttgart, Germany, to head the Institute for Microelectronics Stuttgart (IMS CHIPS). In addition, he is affiliated with the University of Stuttgart as a full professor. Dr. Burghartz has published more than 350 reviewed articles and holds about 30 patents.
Dr. Zili Yu received her PhD degree in 2012 from the Delft University of Technology (TU Delft), The Netherlands, on Low-Power Receive-Electronics for a Miniature 3D Ultrasound Probe. From 2012 to 2013, she was a post-doctoral researcher at TU Delft, working on ultrasound ASICs. She joined the Institut für Mikroelektronik Stuttgart (IMS CHIPS) in 2013. Since 2016, she has been leading the Department of System Development and later the Department of Sensor Systems, focusing on ASIC designs for various sensor applications, as well as the research on Hybrid Systems-in-Foil (HySiF).
Flexible Electronics for Smart Sensor Systems
Eugenio CantatoreDepartment of Electrical Engineering, Eindhoven University of Technology 5612 AZ Eindhoven, The Netherlands
Flexible large-area electronics based on TFTs is an ideal platform to build smart sensors systems based on the integration of sensing elements, sensor interface circuits, signal processing and data transmission. Depending on the application, matrices or single sensors might be needed, as well as the use of TFTs together with Silicon ICs could be demanded. Applications span a variety of domains in the Internet of Things world: from wearables for the measurement of vital signs and biopotentials, to matrices of physical sensors (e.g. pressure, infrared radiation), to smart sensors integrated in RFID or NFC tags. Designing the architecture and the single circuit blocks for these increasingly more complex systems is a grand challenge due to e.g. the limited performance of flexible TFTs, and the difficulty to interface TFTs with sensors or Silicon Integrated Circuits.
An overview of recent achievements in the field of smart flexible sensor systems and a vision for the future of this exciting research domain will be the main focus of this talk.
Eugenio Cantatore received his Master’s and Ph.D. Degree in Electrical Engineering from Politecnico di Bari, in 1993 and 1997 respectively. Till 1999 he was fellow at the European Laboratory for Particle Physics (CERN), Geneva. In 1999 he moved to Philips Research, Eindhoven, and in 2007 joined the Eindhoven University of Technology, where he is full professor since 2016. His research interests include the design and characterization of electronic circuits exploiting emerging technologies and the design of ultra-low power micro-systems. He authored or co-authored more than 200 papers in journals and conference proceedings, and 13 patents. He has been active in the Technical Program Committees of ESSDERC, IWASI, ESSCIRC and ISSCC. At ISSCC he has been chair of the Technology Directions subcommittee, Program Chair in 2019 and is presently Conference Vice Chair. He is member at large of the SSCS AdCom, associate editor of the IEEE Transactions on Circuit and Systems I and editor in chief of the IEEE Open Journal of the Solid-State Circuits Society. In 2006 he received the ISSCC Beatrice Winner Award for Editorial Excellence and was nominated in the Scientific American top 50 list. He received the Philips Research Invention Award in 2007, the Best Paper Award from ESSDERC 2012 and the Distinguished Technical Paper Award from ISSCC 2015. He was nominated IEEE Fellow in 2016.
A platform perspective for fully-printed integrated circuits
Giorgio Dell'ErbaFLEEP Technologies
Efforts in the development of printed and flexible devices are now encouraged by the increased maturity of the field of printed electronics. However, demonstrations of complex systems based only on printed or flexible components are still limited. This factor restricts the possibilities for the technology to reach the market, with a cascading effect on the entire supply chain. The main limitations to the development of the whole industry are given by the intrinsic difficulties in the multi-device integration and by the lack of a consolidated technology for the processing of signals coming from sensors, for the regulation and exploitation of energy sources and for the piloting of actuators to provide feedback to the final user. For this reason, there is wide interest in the development of flexible integrated circuits (IC) that allow to exploit the full potential provided by this type of technology. In this context, a platform-based approach is desirable in order to take advantage of the peculiarities of printed electronics and access the sustainable side of this technology.
Giorgio Dell'Erba received his MSc degree from Politecnico di Milano (Italy, 2012) in Electronic Engineering with specialization in Electronics for Medicine and Nano-Biotechnology. He then obtained his PhD in Electronics (Italy, 2015) at Politecnico di Milano with a full scholarship from the Italian Institute of Technology. In 2016, he received the Young Innovator Under 35 award from MIT Technology Review Italy. During his postdoctoral studies, Dell'Erba received a Fulbright scholarship to study Entrepreneurship at Santa Clara University Leavy School of Business (California, USA, 2018). During the same period, he was a Visiting Post-Doc at Lawrence Berkeley National Labs (California, USA). In 2019, he founded FLEEP Technologies (FLEEPtech) of which he is currently CEO. Giorgio is a mentor for multiple renowned startup accelerators such as INAM Berlin and Plug And Play Tech Center and is Scout Fellow for Berkeley Skydeck VC.
Towards GHz flexible organic electronics
Karl LeoDresden Integrated Center for Applied Physics and Photonics (IAPP), Technische Universität Dresden
Karl Leo obtained the Diplomphysiker degree from the University of Freiburg in 1985, working with Adolf Goetzberger at the Fraunhofer-Institut für Solare Energiesysteme. In 1988, he obtained the PhD degree from the University of Stuttgart for a PhD thesis performed at the Max-Planck-Institut für Festkörperforschung in Stuttgart under supervision of Hans Queisser. From 1989 to 1991, he was postdoc at AT&T Bell Laboratories in Holmdel, NJ, U.S.A. From 1991 to 1993, he was with the Rheinisch-Westfälische Technische Hochschule (RWTH) in Aachen, Germany. Since 1993, he is full professor of optoelectronics at the Technische Universität Dresden. His main interests are novel semiconductor systems like semiconducting organic thin films; with special emphasis to understand basics device principles and the optical response. His work was recognized by a number of awards, including: Otto-Hahn-Medaille (1989), Bennigsen-Förder-Preis (1991), Leibniz-Award (2002), award of the Berlin-Brandenburg Academy (2002), Manfred-von-Ardenne-Preis (2006), Zukunftspreis of the German president (2011), Rudolf-Jäckel-Prize (2012), Dr. techn. h.c. of the University of Southern Denmark (2013), and Technology Transfer Prize of the DPG (2016). He is cofounder of several companies, including Novaled GmbH and Heliatek GmbH.
Optimizing Design and Fabrication of Flexible Hybrid Electronics for Medical and Industrial Applications
Mark PoliksState University of New York at Binghamton
Mark D. Poliks is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor of Engineering in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. His research is in the areas of industry relevant topics that include: high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.
He received FLEXI awards for leadership in Technology and Education from the FlexTech Alliance in 2009 and 2019. He has authored over one hundred fifty technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society Distinguished Lecturer.
Low-Noise Flexible Sensor Sheets for Imperceptible Biomonitoring System
Takafumi UemuraOsaka University
Takafumi Uemura received B.S., M.S., and Ph.D. degrees in applied physics from Osaka University, Japan, in 2003, 2005, and 2008, respectively. During 2008-2010, he was a Postdoctoral Researcher at Osaka University. During 2010?2013, he was an Assistant Professor of the Institute of Scientific and Industrial Research, Osaka University. During 2013?2015, he was a Project Lecturer at The University of Tokyo. During 2013?2014, he worked at IMEC as a Visiting Professor at KU Leuven, Belgium. Since 2015, he has been a Specially Appointed Associate Professor at Osaka University. His areas of expertise are organic semiconductor physics and flexible electronic devices, and he is promoting the development of applications for digital healthcare and IoT sensor devices.
AI Meets The Real World: Sensing Technologies Based on Large-Area Electronics for Advancing Machine Perception
Naveen VermaDirector of the Keller Center for Innovation in Engineering Education and Professor of Electrical Engineering, Princeton University
Machine capability has reached an inflection point, achieving human-level performance in tasks traditionally associated with cognition (vision, speech, gameplay). However, efforts to move such capability pervasively into the real world, have in many cases fallen far short, compared to the relatively constrained and isolated demonstrations of success. A major insight emerging is that structure in data can substantially enhance machine learning. This talk explores how complex processes of the real world can be addressed by preforming sensing in ways that preserve the rich structure of the real world. This evokes questions like: what sort of structure is useful; what sort of machine-learning models can exploit such structure; what sensing technologies enable this structure? Large-area/flexible electronics presents unique capabilities for deploying large and expansive arrays of form-fitting sensors, which can enable valuable structure in sensor data. This talk explores technological, architectural, and algorithmic opportunities and advances for harnessing such capabilities in next-generation systems, as well as prototype demonstrations of the resulting systems.
Naveen Verma received the B.A.Sc. degree in Electrical and Computer Engineering from the UBC, Vancouver, Canada in 2003, and the M.S. and Ph.D. degrees in Electrical Engineering from MIT in 2005 and 2009 respectively. Since July 2009 he has been at Princeton University, where he is current Director of the Keller Center for Innovation in Engineering Education and Professor of Electrical Engineering. His research focuses on advanced sensing systems, exploring how systems for learning, inference, and action planning can be enhanced by algorithms that exploit new sensing and computing technologies. This includes research on large-area, flexible sensors, energy-efficient statistical-computing architectures and circuits, and machine-learning and statistical-signal-processing algorithms. Prof. Verma has served as a Distinguished Lecturer of the IEEE Solid-State Circuits Society, and on a number of conference program committees and advisory groups. Prof. Verma is the recipient of numerous teaching and research awards, including several best-paper awards, with his students.
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