SHORT
COURSES

IFETC Short Courses will be offered in blocks of parallel sessions. AM Short Courses will be held from 8 AM - 12 PM and PM Short Courses from 1 PM - 5 PM on August 8, 2021.

AM Course 1 - Printed Electronics – Materials, Processes and Devices Presented by OE-A

Moderator: Jan Krausmann (OE-A)

Presentation 1
Instructor: Antonio Facchetti (Northwestern University/Flexterra)

Presentation 2: Flexible Hybrid Electronics Manufacture – An Overview
Instructor: Simon Johnson (Centre for Process Innovation)

This short tutorial will present an overview of the techniques and technologies used in the manufacture of flexible hybrid electronic (FHE) circuits. The fundamentals of the technologies will be discussed along with the assembly techniques and we will also consider the types of circuits that can be built with FHE. The benefits of the circuit form will be considered along with the challenges and some solutions. Roll to Roll manufacture of electronics will be discussed to show the approach to scale up for industrial applications. Some case studies will also be used to illustrate many aspects of this exciting technology.

Dr Simon Johnson is the Chief Technologist within Electronics at the Centre for Process Innovation in the UK. In his current role Simon acts as a knowledge expert in Printable and Flexible Electronics, supporting strategic and development activities in the business. While at CPI Simon has lead the development of processes for the assembly of hybrid flexible electronic systems including printed sensors, wireless sensor systems and roll to roll circuit design and assembly. In previous roles as an academic at the University of Durham and also in industry, Simon has worked in many aspects of electronics from CMOS IC design and development to electronic systems and software development.

Presentation 3: Printed Electrochemical Biosensors for Medical Diagnostics
Instructor: Giorgio Mutinati (AIT Austrian Institute of Technology)

The decentralization of the health care system, driven by the demographic change, creates a strong demand for sustainable high volume and low-cost biosensors that enable molecular diagnostics outside of laboratories. At present, non-invasive point-of-care rapid tests are mostly available in the form of single-use test strips based on a colorimetric readout. The reading of these test strips is strongly influenced by subjective visual perception and the results are, therefore, hardly reproducible and only qualitative. An important exception are electrochemical glucose sensors, which are successfully on the market for several years now. However, they require the diabetic patients to prick their finger and are not used for continuous glucose monitoring. Printing technologies play a key role to overcome these limitations by enabling: i) the use of cost-effective substrates and materials, ii) the effective manufacturing of biosensors using roll-to-roll processes, iii) the use of digital technologies such as inkjet printing to print specifically formulated bio-inks for the sensor surface functionalization, iv) the integration of discrete microchip and printed components such as antennas and batteries for the processing and wireless transfer of measurement data. Making use of these possibilities, the printed biosensors, which are in development now, can be used either as single- use quantitative tests or as monitoring device integrated in wearables. This short course will give an overview about the printed biosensors on the market and in development. Particular attention will be given to the novel applications, the involved printing technologies and the development work done on this topic at AIT Austrian Institute of Technology.

Giorgio C. MUTINATI, PhD, after his degree in physics, specialized in micro- and nanotechnology and solid state electronics. After seven years at the R&D departments of semiconductor industries, he joined AIT Austrian Institute of Technology in 2010. His research activities as senior research engineer and project manager focus on printing technologies for the realization of electrochemical biosensors.also in industry, Simon has worked in many aspects of electronics from CMOS IC design and development to electronic systems and software development.

AM Course 2 - Printed Electronics for Automotive Applications Presented by OE-A

Moderator: Klaus Hecker (OE-A)

Presentation #2: IMSE Technology for Smart Molded Structures - Technology Verification
Instructor: Outi Rusanen (TactoTek)

This short course is a continuation to Dr. Antti Keränen’s short course on IMSE Technology. It explains why and how the company verifies electronics components and surface mounting adhesives. It has also results from reliability testing. The short course is divided into three parts. The first part describes the verification process, electrical component and surface mounting adhesive verification are discussed in more detail. Many of the packages and surface mounting adhesives, optimized for conventional electronics, can be used with IMSE technology. However, their suitability needs to be verified because conventional electronics does not include the temperature and pressure exposures from thermoforming and injection molding processes. One of the IMSE application areas is automotive and the OEMs have stringent reliability requirements. Before IMSE product validation in automotive use cases, TactoTek has already verified the technology. The second explains the reliability test definition for technology verification. The third part shows results from IMSE verification and product validation testing. The results are from technology verification platforms as well as from demonstrator and customer products. We present reliability testing results together with root cause analysis.

Dr. Outi Rusanen received her MSc, Lic. Sc. and D. Sc (Tech.) degrees in electrical engineering from the University of Oulu, Finland in 1988, 1998 and 2000, respectively. She currently works as Principal Interconnection Specialist in the Research and Development Team at TactoTek. Dr Rusanen has 30 years’ experience with electronics interconnections and reliability. She has previously worked at Huawei Finland, Nokia Mobile Phones and Technical Research Centre of Finland (VTT). Dr Rusanen has co-authored about 60 journal and conference papers.

PM Course 1 - Flextronics: A Hard Barrier for Flexible Teaching?

Instructor: Savas Kaya (Ohio University)

As it becomes more accessible and mainstream, flexible electronic devices and integrated systems (or flextronics) technologies present unique challenges for instructors and tremendous opportunities of learning for students on a broad spectrum of engineering subjects. On the one hand lies the significant challenges of arranging, simplifying and presenting very diverse range of properties related to materials (nano-inks, carbon nano-structures, conductive polymers, organic semiconductors, metal-oxide thin-films), substrates (polymers, papers, textile and composites), printing technologies (laser, screen, flexographic, gravure, inkjet, aerosol Jet) and devices (RLC passives, thin-film transistors, antennas, solar cells, OLEDs & displays, supercapacitors, batteries and sensors) as well as virtually unlimited range of applications. On the other hand is the tremendous learning opportunities in reviewing scientific fundamentals, integrated device design and exploring creative solutions with flexible technologies for seniors and graduate students that cannot be found easily in such a comprehensive fashion. On either front, there is a sheer volume of material to be explored and contextualized, which present challenges for all involved. In this tutorial session, we will describe and analyze some of these challenges and opportunities for building a successful course in Flextronics education and propose an example course syllabus based on the best practices as surveyed from reputable institutions around the world. The tutorial is intended for both researchers and educators planning to develop a course in Flextronics as well as students who wishes to develop a wholesome overview of flexible electronics from an educator’s perspective.

Savas Kaya (SM'07) received the M.Phil. degree from the University of Cambridge, Cambridge, U.K., in 1994, with a focus on polarization insensitive liquid crystal switches and the Ph.D. degree from the Imperial College of Science, Technology and Medicine, London, U.K., in 1998, with a focus on strained Si quantum wells on vicinal substrates. He was a post-doctoral researcher at the University of Glasgow between 1998 and 2001, carrying out research in transport and scaling in Si/SiGe MOSFETs, and fluctuation phenomena in decanano MOSFETs. He is currently a professor with the Russ College of Engineering at Ohio University, Athens. Besides, flexible electronics and printed sensors, his other interests include transport theory, device modeling and process integration, nanofabrication, nanostructures and nanosensors for flexible electronics integration.

PM Course 2 - Additive Manufacturing of Geometrically-Complex Electronics and Electromagnetics

Instructor: Eric MacDonald (Additive Printing)

3D printing has been historically relegated to fabricating conceptual models and prototypes; however, increasingly, research is now focusing on fabricating functional end-use products. As patents for 3D printing expire, new low-cost desktop systems are being adopted more widely and this trend is leading to a diversity of new products, processes and available materials. However, currently the technology is generally confined to fabricating single material static structures. For additively manufactured products to be economically meaningful, additional functionalities are required to be incorporated in terms of electronic, electromechanical, electromagnetic, thermodynamic, chemical and optical content. By interrupting the printing processes and employing complementary manufacturing, additional functional content can be included in mass-customized complex structures.

The two-hour short course will provide a comprehensive overview of the full taxonomy of additive manufacturing processes as defined by the ISO/ASTM 52900 standard. Each of the seven additive manufacturing processes will be described in terms of both operation and in the context of benefits and challenges for electronics and electromagnetics. A diversity of case studies will be provided highlighting the profound benefits of fabricating electronics with the design freedom, mass customization and geometrical-complexity that additive manufacturing brings to bear.

Eric MacDonald, Ph.D. is a professor of mechanical at the University of Texas at El Paso and engaged in the W.M. Keck Center for 3D Innovation. Dr. MacDonald received his doctoral (2002) degree in Electrical and Computer Engineering from the University of Texas at Austin. He worked in industry for 12 years at IBM and Motorola and subsequently co-founded a start-up specializing in CAD software and the startup was acquired by a firm in Silicon Valley. Dr. MacDonald held faculty fellowships at NASA’s Jet Propulsion Laboratory, US Navy Research and was awarded a US State Department Fulbright Fellowship in South America. His research interests include 3D printed multi-functional applications and process monitoring in additive manufacturing with instrumentation and computer vision for improved quality and yield. As a co-founding editor of the Elsevier journal Additive Manufacturing, MacDonald has help direct the journal to have the highest impact factor among all academic journals worldwide in manufacturing. Recent projects include 3D printing of structures such as nano satellites with structurally-embedded electronics (one of which was launched into Low Earth Orbit in 2013 and a replica of which was on display at the London Museum of Science). He has over 100 peer-reviewed publications, dozens of patents (one of which was licensed by Sony and Toshiba from IBM). He is a member of ASME, ASEE, senior member of IEEE and a registered Professional Engineer in the USA state of Texas.